Hi,
On the http://www.ti.com/ww/en/launchpad/byob.html site TI recommends the stackability from bottom to top, meaning the boosterpacks to have female pin sockets and be put on top of the LaunchPad's male pin headers. What is the reason behind such attitude and is it any better than stacking the other way around - i.e to put booster packs on the bottom of the LP.
In my application (field-operating weather station) I'd like to have the pcb with the GSM modem tied to the case with male pin headers exposed and to attach the LP on top of that. Can I fall into any traps/inconviniences with such method? I don't think so because these headers are electrically the same with pin sockets but there may be something I missed.
Best Regards,
tml